DFM Inspection
The following items of the customer’s designed PCB, BOM, schematic diagram, and finished assembly manual will be inspected:
File version and last update time
Process technology: lead-free/lead-containing
Clear component part numbers and silk screen
BOM including manufacturer brand and part number, description, and part number
Confirm the PCB manufacturing process: material, board thickness, copper thickness, number of layers, surface treatment, character color and special processes
Reasonable PCB layers and assembly method
Provide correct SMT soldering files
Complete program burning and functional testing plans
Clear finished assembly manual and diagrams
Other special process requirements
New Product Introduction Meeting (New Product Introduction Meeting)
Organize personnel from sales department, engineering department, production department, purchasing department, quality department, etc. to hold a new product introduction meeting:
Introduce the background of the customer project, product application scope, delivery date and special requirements
Determine the internal customer number and product number
Clarify the production batch, purchase and delivery quantity
Evaluate the difficulty of the process technology and key quality control points of the project
Clarify the procurement cycle of PCB and electronic components
Propose a draft production plan
Prepare fixtures, jigs, and auxiliary materials required during the production process
Clarify the test plan for the customer’s product
PCB manufacturing
We outsource PCB manufacturing and strictly control the following quality key points:
High-quality brand materials
Select the top ten PCB suppliers nationwide
Continuously establish supplier relationship management
Have the capability to complete 3mil line width spacing, multi-layer, HDI, impedance, and blind-buried holes processing
All PCBs delivered to our company must undergo 100% electrical testing
Electronic component procurement
100% purchase according to the brand and part number specified in the customer’s BOM (unless due to procurement cycle reasons, the customer agrees in writing to purchase other alternative materials)
Purchase materials through regular channels such as first-level agents and top trading companies
Can provide original origin certificates of first-level agents
Have good centralized purchasing advantages, obtaining shorter procurement cycles, latest material years, and stocking advantages, etc.
Provide complete original factory technical support
IQC incoming material inspection
Measure the thickness of the PCB
Check whether the through holes and ink of the PCB are blocked, etc.
Check whether the PCB has warping deformation, whether the silk screen is clear
Check whether the PCB has broken wires, jumpers, etc. defects
Place the PCB in the reflow soldering furnace for temperature testing to check if it turns yellow or deforms
Check the batch number, part number, and silk screen of the incoming electronic components to see if they are consistent with the BOM
Place the incoming electronic components on the PCB bare board for pad or through hole adaptation tests
Randomly inspect the resistance, capacitance, etc. of the incoming electronic components and compare them with the BOM
Check whether the surface of the incoming electronic components has scratches, deformation, broken legs, short legs, etc. of appearance defects
Storage of components and solder paste printing
Store sensitive components in a professional constant temperature and humidity box
For some strictly required PCBs/ICs/BGA, bake for 2-12 hours to remove surface moisture and enhance solderability
Use first-line brand solder paste
Issue high-quality laser steel mesh
Complete solder paste freezing, thawing and stirring operation procedures
Equipped with a fully automatic solder paste printing machine to ensure the consistency and reliability of solder paste printing in the batch production process
SMT assembly processing
Use Samsung SM471/481/482, Fuji CP8/CP6 series high-speed fully automatic SMT assembly machines with a precision of 01005
Equipped with an electric feeder to reduce the rate of discarding materials and the probability of fault warnings
Support mainstream chip types such as QFN, SOP, SOT, TSOP, QFP, BGA, PLCC
The maximum single machine capacity of SM471 is 75,000 pieces per hour
Equipped with 16 temperature zones reflow soldering, setting qualified temperature curves
Use a temperature tester every 4 hours to detect the temperature and record it
Use AOI optical inspection instrument to batch inspect defective items, missing items, reverse, soldering errors, etc.
Use X-Ray to inspect boards containing secret balls BGA
DIP plug-in processing
Strict workstation operation instructions
Use wave soldering fixtures for batch production to ensure the reliability and consistency of the welding
Use well-known brand wave soldering
Equipped with 3 plug-in production lines to meet batch production needs
Equipped with a carving machine, and the engineering department issues test stands according to customer requirements, capable of completing the program burning and functional testing of mainstream chips